Customization Precision Machined Semiconductor Test Socket High Performance

Product Overview

The Semiconductor Test Socket Guide is engineered to deliver consistent performance across thousands of test insertions. By controlling vertical axis movement, it prevents off-axis actuation that can cause uneven contact force or premature probe wear. Precision-machined guide holes with chamfered lead-ins and optimized clearance profiles ensure smooth compression of pogo pins. The result is repeatable contact resistance, extended socket life, and superior reliability in high-throughput ATE environments.

Surface & Finish

• Contact Channels: Ra ≤ 0.2 µm (mirror finish)

• Non-Contact Surfaces: Ra ≤ 0.8 µm

• Burr-Free: Micro-deburred edges, ISO 13715 compliant

Protective Coatings & Plating Options

• Hard-coat anodizing (Aluminum)

• Electroless Nickel (50–100 µin)

• Gold Flash (0.1–0.3 µin) for enhanced conductivity

Cleanliness & Packaging

• Class 100 cleanroom packaging

• Non-volatile residue <5 µg/cm²

• Ion-free option available

Certifications

ISO 9001:2015 | IPC-9592 (High-Reliability) | MIL-STD-883

Technical Advantages

• Built from CTE-matched polymers or ceramic-filled compounds for resistance to thermal distortion

• Maintains dimensional stability at temperatures >150 °C during HTOL and burn-in procedures

• Prevents warping, misalignment, or probe disengagement under thermal cycling

• Designed for >100,000 insertions with high-hardness composites and abrasion-resistant materials

• PTFE fillers or dry-film coatings reduce friction, galling, and particle generation

With its precision engineering, the Semiconductor Test Socket Guide ensures dimensional integrity, long-term durability, and reliable test results — even under demanding mechanical and thermal conditions.

Precision Machined Semiconductor Test Socket

Semiconductor Test Socket High Performance

Customization semiconductor socket

Customization Precision Machined Semiconductor Test Socket High Performance Images