Sign In | Join Free | My benadorassociates.com
China Dongguan Yiding Technologies Co., Ltd. logo
Dongguan Yiding Technologies Co., Ltd.
Committed to Quality, Driven by Precision
Verified Supplier

1 Years
Home > IC Test Socket >

Burr Free Semiconductor Test Sockets With Tight Tolerance Precision Engineering

Product Categories
Dongguan Yiding Technologies Co., Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Burr Free Semiconductor Test Sockets With Tight Tolerance Precision Engineering

Brand Name : Yiding

Certification : ISO 9001

Place of Origin : Guangdong, China

Material Specification : Stainless Steel 17-4PH (standard), Beryllium Copper (high-cycle), Titanium (lightweight); optional nickel or gold plating.

Dimensional Tolerances : Critical Features – ±0.005 mm (device alignment); Overall Body – ±0.02 mm

Flatness/Coplanarity : ≤0.01 mm across seating surface (ensures uniform contact pressure).

Pin/Lead Channel Width & Depth : Width – ±0.003 mm; Depth – ±0.005 mm (adjustable for lead deflection).

Pin/Lead Channel Pitch Accuracy : ±0.005 mm (fine-pitch ICs), ±0.01 mm (standard).

Contact Now

Semiconductor Test Socket Guide
Product Overview
The Semiconductor Test Socket Guide is engineered to deliver consistent performance across thousands of test insertions. By controlling vertical axis movement, it prevents off-axis actuation that can cause uneven contact force or premature probe wear. Precision-machined guide holes with chamfered lead-ins and optimized clearance profiles ensure smooth compression of pogo pins. The result is repeatable contact resistance, extended socket life, and superior reliability in high-throughput ATE environments.
Surface & Finish
  • Contact Channels: Ra ≤ 0.2 µm (mirror finish)
  • Non-Contact Surfaces: Ra ≤ 0.8 µm
  • Burr-Free: Micro-deburred edges, ISO 13715 compliant
Protective Coatings & Plating Options
  • Hard-coat anodizing (Aluminum)
  • Electroless Nickel (50-100 µin)
  • Gold Flash (0.1-0.3 µin) for enhanced conductivity
Cleanliness & Packaging
  • Class 100 cleanroom packaging
  • Non-volatile residue <5 µg/cm²
  • Ion-free option available
Certifications
ISO 9001:2015 | IPC-9592 (High-Reliability) | MIL-STD-883
Technical Advantages
  • Built from CTE-matched polymers or ceramic-filled compounds for resistance to thermal distortion
  • Maintains dimensional stability at temperatures >150 °C during HTOL and burn-in procedures
  • Prevents warping, misalignment, or probe disengagement under thermal cycling
  • Designed for >100,000 insertions with high-hardness composites and abrasion-resistant materials
  • PTFE fillers or dry-film coatings reduce friction, galling, and particle generation
With its precision engineering, the Semiconductor Test Socket Guide ensures dimensional integrity, long-term durability, and reliable test results — even under demanding mechanical and thermal conditions.

Product Tags:

Burr Free Semiconductor Test Sockets

      

tight Tolerance Semiconductor Test Sockets

      

precision engineering semiconductor socket

      
Quality Burr Free Semiconductor Test Sockets With Tight Tolerance Precision Engineering for sale

Burr Free Semiconductor Test Sockets With Tight Tolerance Precision Engineering Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Dongguan Yiding Technologies Co., Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
You May Like